OMAP3630 DataSheet下载

The OMAP36xx high-performance, multimedia application device is based on the enhanced OMAP™ 3 architecture and is integrated on TI advanced 45-nm process technology. The architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: • Streaming video • 2-dimension/3-dimension (2D/3D) mobile gaming • Video conferencing • High-resolution still image • Video capture in 2.5G wireless terminals, 3G wireless terminals, rich multimedia-featured handsets, and high-performance personal digital assistants (PDAs) The device supports high-level operating systems (OSs) such as: • Android™ OS • Linux® • Symbian OS™ • Windows® CE This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device: • Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor • Imaging video and audio (IVA2.2) subsystem with a TMS320C64x™ digital signal processor (DSP) core • POWERVR® SGX530 subsystem for 2D and 3D graphics acceleration to support display and gaming effects • Camera image signal processor (ISP2P) that supports multiple formats and interfacing options to a wide variety of image sensors • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out. • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals The device also offers: • A comprehensive power and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex™ adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption. • Connectivity to various cellular modem chipset • Memory stacking feature using the package-on-package (POP) implementation (see Section 1.4, Package-on-Package Concept)