2015年全球光通信大会论文集分卷3来源于美国光纤通讯展览会及研讨会(OFC)

Symposium on Beyond The Gold Box: The Future Of Integrated Optics W1HBeyond the Gold Box: The Future of Integrated Optics I W1H.1 Beyond CFP2-ACO W1H.2 Device Technologies for Integrated Packaged Transceivers W1H.3 Impact of Pluggable Analog Coherent Optics Modules on Line Card Architecture and DSP Functionality W1H.4 Integrated Devices for Metro Applications W1H.5 Integrated Devices for High-Performance Optical Links W1H.6 Future Narrow Linewidth Lasers W3HBeyond the Gold Box: The Future of Integrated Optics II W3H.1 InP Photonic Integrated Circuits for High Efficiency Pluggable Optical Interfaces W3H.2 High Bandwidth Transceivers Using Heterogeneous Integration on Silicon W3H.3 Silicon Photonics … With The Photons W3H.4 Photonic Packaging in High-Throughput Microelectronic Assembly Lines for Cost-Efficiency and Scalability W3H.5 Embracing Diversity – Interconnecting Different Materials and Components for the Lowest $/Gb W4HBeyond the Gold Box: The Future of Integrated Optics III W4H.1 Circuit Design Techniques For High Bit Rate and High Density Optical Interconnects W4H.3 Low-Power MOS-Capacitor Based Silicon Photonic Modulators and CMOS Drivers W4H.4 Deploying DSP in Optical Transceiver Modules W4H.5 Can Discrete Multi-Tone Reduce the Cost for Short Reach Systems? W4H.6 Investigation of 50 GBd PAM-4 Electrical Interfaces for 2km Data Center Interconnects