资源介绍
东芝emmc芯片手册，THGBMBG9D8KBAIG is 64GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized
advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG9D8KBAIG
has an industry standard MMC protocol for easy use.
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